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device performance specification revision 5.1 mtd/ps-0229 september 12, 2008 kodak kli-2113 image sensor 2098 x 3 tri-linear ccd image sensor
table of contents summary sp ecification ............................................................................................................................... ................................ 4 description ............................................................................................................................... ................................................... 4 features ............................................................................................................................... ........................................................ 4 applic ations ............................................................................................................................... .................................................. 4 ordering information ............................................................................................................................... ................................... 5 devi ce descriptio n ............................................................................................................................... ....................................... 6 exposure con t rol ............................................................................................................................... ...................................... 7 pixel su mmin g ............................................................................................................................... .......................................... 7 image acquisition ............................................................................................................................... ......................................... 7 charge tran s p ort ............................................................................................................................... ......................................... 7 physical de scription ............................................................................................................................... ..................................... 8 pin des c ription and device orientation ............................................................................................................................... ... 8 imaging performance ............................................................................................................................... .................................. 9 typical oper atio nal conditions ............................................................................................................................... .................... 9 specification s ............................................................................................................................... ............................................... 9 typical performance curves ............................................................................................................................... ...................... 11 def ect defi nitions ............................................................................................................................... ....................................... 12 operationing condition s ............................................................................................................................... ............................. 12 operation ............................................................................................................................... .................................................... 13 absolute maximum rating s ............................................................................................................................... ....................... 13 dc b i as operating conditio ns ............................................................................................................................... ................... 14 ac oper ating condition s ............................................................................................................................... ............................ 15 clock le vels ............................................................................................................................... ............................................ 15 ac ti ming le vels ............................................................................................................................... .................................... 15 timing ............................................................................................................................... ......................................................... 16 storage and handling ............................................................................................................................... ................................ 18 storage cond itions ............................................................................................................................... ..................................... 18 esd ............................................................................................................................... ............................................................. 18 c o ver glas s ca re a n d c l ea n l ines s ............................................................................................................................... ............ 18 environment a l exp o sure ............................................................................................................................... ............................ 18 soldering re commendations ............................................................................................................................... .................... 18 mechanical in formation ............................................................................................................................... ............................. 19 co mpleted as sembl y ............................................................................................................................... ................................. 19 quality a ssur a nce and reliability ............................................................................................................................... .............. 21 qualit y str a tegy ............................................................................................................................... .......................................... 21 replace m ent ............................................................................................................................... .............................................. 21 li ability of th e supplier ............................................................................................................................... .............................. 21 li ability of th e cu stomer ............................................................................................................................... ............................ 21 reliab ility ............................................................................................................................... .................................................... 21 test d a ta ret e ntion ............................................................................................................................... .................................... 21 mechanical ............................................................................................................................... .................................................. 21 warning: life suppor t applications policy ............................................................................................................................... 21 revision ch anges ............................................................................................................................... ....................................... 21 ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 2
t a ble of fi gure s figure 1: single ch annel sc hematic ............................................................................................................................... ............... 6 figure 2: output wavefor m s ............................................................................................................................... .......................... 11 figure 3: typical resp onsivity ............................................................................................................................... ....................... 11 figure 4: esd protection circuit ............................................................................................................................... ................... 13 figure 5: typical outp ut bias /buffer cir c uit ............................................................................................................................... .1 4 figure 6: line timing ............................................................................................................................... ..................................... 16 figure 7: output timing ............................................................................................................................... ................................. 17 figure 8: completed asse mbly dra w ing (1 o f 2) ......................................................................................................................... 19 figure 9: completed asse mbly dra w ing (2 o f 2) ......................................................................................................................... 20 ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 3
summary specification ko da k kli-2113 imag e sensor 2098 x 3 tri-linear ccd image sensor description the k o da k kl i - 21 1 3 ima g e se ns or is a high dynamic range, multi s pectral, linear ccd image sensor ideally suited f o r de manding colo r sc anner app l ication s . the imager c o nsists of three parallel 2098-element photodiode ar ray s ?one for ea ch primary color. the kli- 2113 sensor o ffers high sensitivit y, a high dat a r a te, lo w noise and neg l igible lag. in dependent exposure contr o l for e a ch chan nel allows color balancing at the fr ont e n d. cmos-compatible 5v clocks, and single 12v d c supply are all th at ar e required to drive the k l i- 2113 sensor, simplifying th e design of in terface electronics. features ? high reso lution ? wide d y namic range ? high sen s itivi t y ? high oper atin g speed ? high charge transfer effic i ency ? no ima g e lag ? electronic exposure contr o l ? pixel su mmin g cap a bility ? up to 2.0v pe ak-peak outp ut ? 5.0v clock in puts ? two-phase register clocking ? on-chip dark reference applications ? photography ? industrial i m aging ? scientific imaging parameter t y p i c a l v a l u e ar chitectur e 3 channel, r g b tr i-linear ccd pi xe ls c o unt 20 98 x 3 pixel size 14 m (h) x 14 m (v) pixel pitch 14 m inte r- ar ra y spa c i n g 11 2 mm (8 li nes effective) image r si ze 29. 37 mm (h) x 0.24 mm (v) satu rati on si gna l 17 0, 00 0 e l e c tro n s dynami c ra nge 76 d b r e sponsivity (wav el en gt h = 460 , 540 , 65 0 n m) 2 5 , 32 , 50 v/j /c m 2 ou tput sen s itivit y 1 1 . 5 v/e le c t r o n da rk c u rre nt 0.0 2 pa/pi x e l dark c u rre nt d o ubli ng rate 9 c char ge tr ans f er ef f i ci e n c y 0 . 9 9 9 99/t r ans f e r ph otor espon s e non - un if or mity 5 % peak-peak lag (first field) 0.6% maximum data rate 20 mh z/channel package cerdip (sidebra zed, cuw) cover glass ar coated, 2 sides par a meter s above ar e specif ied at t = 2 3 c (jun cti o n temper atu r e) an d 2 mhz c l oc k rate s unle ss ot he rwi s e note d ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 4
o r der ing inf orm a tion ca talog number product name descrip tio n m a r k i n g co de 4h0 6 0 2 k l i - 2 1 1 3 -aaa-e r - a a monochrome, no microlens, cerdip pa ckage (leadframe), taped clear cover glass with ar co ating (2 sides), standar d gr ade 4h0 6 0 5 k l i - 2 1 1 3 -aaa-e r - a e monochrome, no microlens, cerdip pa ckage (leadframe), taped clear cover glass with ar co ating (2 sides), engineering samp le kli-2 1 1 3 -aaa (serial numbe r ) 4 h 06 01 k l i - 21 13 -a a b -e d - a a monochrome, no microlens, cerdip pa ckage (leadframe), clear c o ver glass with ar coati n g (both sides), standar d gr ade 4 h 06 04 k l i - 21 13 -a a b -e d - a e monochrome, no microlens, cerdip pa ckage (leadframe), clear c o ver glass with ar coati n g (both si des), engineering sample kl i - 21 13 -a a b (serial numbe r ) 4 h 06 00 k l i - 21 13 -d a a - e d -a a color (rg b ), no microlens, cerd ip pa ckage (leadframe), clear cover glass with ar coati n g (both sides), standar d gr ade 4 h 06 03 k l i - 21 13 -d a a - e d -a e color (rg b ), no microlens, cerd ip pa ckage (leadframe), clear cover glass with ar coati n g (both si des), engineering sample kl i - 21 13 -d a a (serial numbe r ) 4h0 0 9 6 ke k- 4h00 96- kl i - 211 3- 1 2 - 5 e v aluati on board (c omple t e ki t) n/a please see i s s appl ication note ?product naming co nvention? (mt d /ps-0892) f o r a full de scri ption of nami ng conventi on us ed fo r koda k im a g e s e ns o r s . for all refere nce documentation, ple a se visi t our web site at www.kodak.c o m/g o /imagers. please addre s s all inquirie s and purchase order s to: image sen s or solution s eastman kod a k co mp any rochester, n e w york 146 5 0 -201 0 phone: (585) 7 22-4 3 8 5 fax: (585) 4 77-4 9 4 7 e-mail: imagers@kod a k.co m kod a k reserves the right to change an y in formation c o ntained herein without not i ce. all in for m ati o n furnished by kod a k is believed to be accurate. ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 5
device description id sub vdd vidn rd r 4 blankccd cells ig 2 1 2 blankccd cells 2098 active pixels 12 test 12 dark tg2 tg1 logn ls photodiode array fd 2s sub f i gure 1: si ngle c h anne l sc he mati c ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 6
exposure c o nt rol exposure control is imple m ented by selectively clocking the log gates during portions of the s c anning line ti me. by applying a large enough po sitive bias to the log gate, the channel potential is increased to a level beyond the 'pinning level' of the phot odiode. (the 'pinning' leve l is the maxi mum channel potentia l that th e photodiode can achieve and is fixed by the doping levels of the structure.) w i th tg1 in an 'off' s t a t e and l o g s t ron g ly bias ed, a l l of the photocur rent will be drawn off t o the ls drain. referring to the timing diagrams, one notes that t h e exposure can be controlled by pulsing the log gate to a 'high' level w h ile tg1 i s tu rning 'off' an d then returning the log gate to a 'low' bias level sometime during the line scan. the effective exposure (t exp ) is net time between the falling edge of the log gate and the falling edge of the tg1 g a te (en d of the line). separate log connections for each channel are provided enabling on- chip light sou r ce and imag e spectral color balancing. as a caution a ry note, the switching transients of the log gates during line readout may inject an artifact at the s e ns or output. ris i ng edge artifact s can be avoided by switching log during the photodiode- t o-ccd transfer period, preferably, during the tg 1 falling e dge. depending on clocking sp eeds, the falling edge of the lo g should b e synchronous with the 1/ 2 sh ift register readout cloc ks. f o r very fast applic ations, the falling edge of the log gate may be limite d by on-chip rc delay s acro ss the arr a y. in th is c a se artifacts may exte nd across one or more pixels. correlated double sampling (cds) processing of the ou tput wavefor m can remove th e first order magnitude of such artifacts. in high dynamic range applications, it may be advisable to limit the log fall ti me s to mini miz e the curre nt transients in the device substr ate an d limit the magnitude of the artifact to an acceptable le vel. pixel summing the effective resolution of th is s e nsor can be varied by enabling the pixel s u mming feature. a s e par a te pin is provided for t h e last sh ift register gate labeled 2s. this gate, when clocked approp riat ely, stores the summation of sign al from adjacent pixels. this combined charge packet is then transferred onto the se nse node. as an example, the sensor c a n be operated in 2-pixel su mming mode (1049 p i xels), by sup p lying a 2s clock which i s a 75% duty cycle signal at 1/2 the frequency of the 2 signal, and modifying th e r clock a s depicted in the timing di agram section. applic ations that require full resolution mode (2098 pix e ls), mu st tie the 2s pin to the 2 pin. refer to the timing diagram section for additional details. image acq u isition during the integration period, an imag e is obtained by gathering electrons generated by photons incident upon the photodiod e s. the charg e collected in the photodiode array i s a li near functio n of the loc a l exp o sure. the charge is stored in the photod iode it sel f and is isolated from th e c c d sh i f t registers du rin g th e in tegration period by the transfer gate s tg1 and tg2, which are held at barrier p o tentials. at the end of the in tegration period, the ccd register clocking is st opped with the 1 and 2 gates being h e ld in a 'high ' and 'low' st ate respectively. next, the tg gates are turned 'on' causing the charge to drain fro m th e photo-diod e into the tg 1 stor age reg i on. as tg1 is turned back 'off', charge is transferred through tg2 and into the 1 storag e region. the tg2 gate is t h en turned 'off', isolating t h e shift reg i sters from the accumul a tion region once again. co mpleme ntary clocking of t h e 1 and 2 ph ase s n o w resu me s f o r readout of the curren t line of data while the next line of data is integr ated. charge transport readout of t h e signal charge is accomplished by two- phase, c o mplementary clocking of the 1 and 2 gates. the register architecture has been d e signed for high speed clocking with minimal transp ort and output signal degradation, while sti ll maintaining lo w (4.75vp-p min) clock swing s for reduced power dissip ation, lower clock noise and simpler driver design . the data in all registers is clocked simultaneou s ly toward the output structu r es. the signal is then transferred to the output structure s in a parallel fo rmat at the fall ing edge of the 2 c l o c k . resettable fl oatin g diffu si on s are used for the charge to voltage conversion while source followers provide buffering to external connections. the potential chang e on the floatin g diffusi on is dependent o n the amount of signal charge and is given by ? vfd = ? q/cfd. prior to each pixel out p ut, the floating diffusion is returned to the rd level by the reset clock, r. ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 7
physical description pin description and devic e orientation pin n a m e descrip t i o n pin n a m e descrip t i o n 1 vid r red outp ut video 28 vidg green outp ut vid e o 2 s u b subst r a t e 2 7 s u b subst r a t e 3 rd reset drain 26 vdd amplifier supp ly 4 r reset clock 25 vid b blue ou tpu t video 5 log r re d ove r f l ow g a t e 24 su b subst r ate 6 logg gr een over flow gate 2 3 n / c n o conn ection 7 su b subst r ate 22 log b blue ove r flow g a te 8 n/c no con n e c ti on 21 n/c no con n e c ti on 9 ls light s h ield/exposure d r ai n 2 0 n / c n o con n e c ti o n 10 ig inp u t g a te /lo g t e s t pi n 19 id inp u t di ode t e s t pi n 11 t g 2 oute r t r a n sfe r g a te 18 t g 1 in ne r t r a n sfe r g a te 12 n/c no con n e c ti on 17 n/c no con n e c ti on 13 2s ph ase 2 sh i f t r e gister su mmin g gate clock 1 6 n/c no conn ection 14 2 phase 2 shi f t re gi ste r c l oc k 15 1 ph ase 1 sh i f t r e gister clock ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 8
imaging performance typical operational conditions specification s given under nomin a l oper ating conditions @ 25 oc ambient, fclk =2 mhz and nomin a l exte rnal vidn lo ad resistor s u n l e s s oth e rwi s e specified. specifica tions d e script i o n symbol m i n . n o m . m a x u n i t s n o t e s verification p l a n satu ration ou tpu t voltage v sat 2 . 0 v p-p 1, 7 di e 8 ou tput sen s itivity ? v o / ? n e 1 1 . 5 v/e - 7 d e s i g n 9 satu ration signa l charge n e,sa t 1 7 0 k e l e c t r o n s de si gn 9 responsivity (@ 650nm) (@ 540nm) (@ 460nm) r 50 32 25 v/j/cm 2 2, 7 de si gn 9 output buff er ba ndwidth f -3db 7 5 m h z @ c load = 10 p f design 9 dynami c ra nge dr 7 6 d b 3 design 9 da rk c u rre nt i dark 0 . 0 2 pa/pi x e l 4 di e 8 char ge tr ans f er ef f i cien c y c t e , . 9 99 99 - 5 design 9 l a g l 0 . 6 1 % 1 s t f i e l d de si gn 9 dc outp ut off s et v o,dc 6 7 9 v o l t s 7 de si gn 9 photo r esponse uniformity prnu 5 10 % p-p 6 die 8 register clock c a pacitance c 5 0 0 p f / p h a s e design 9 transfer gate ca pacitance c tg 4 0 0 p f design 9 ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 9
notes : 1. defined as the maximum ou t p ut lev e l achiev able b e f o r e l i n e a r i t y o r p r n u p e r f o r m a n c e i s degraded . 2. with color filte r . values specified at filter peaks. 50% bandwidth = 30 nm . 3. this device utili z es 2-phase clocki ng for cancellation o f driver displacement currents. symmetry between 1 and 2 phases must be maint a ined to minim i ze clock noise . 4. da rk current d o ubles a pproxima t ely ev ery +9 c . 5. me asure d pe r transfe r . f o r total line h < (.99999) 4256 =0.96 6. low frequency response across array with color filte r array . 7. decreasing external vidn load resistors to improve signal bandwidth will decrease these parameters . 8. a par a meter that is me asured on every s e ns or during production te s t ing. 9. a p a rameter that is quantified during the design verific a tion activit y . ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 1 0
typical performance curves (2 mhz oper ation, emitter follower buffered , 3/4 v s at , dark to brig ht transition) vidr output (1v/div) 2 clock (2v/div) time (200 ns / d iv) f i gure 2: o u tp ut wa ve forms k l i- 2113 s p ect r a l r esponse im pr ov e d c o lor filt e r - t y pe ii 0 10 20 30 40 50 60 350 400 450 500 550 600 650 700 750 800 850 wa v e le ngt h ( n m ) r e s pons iv ity (v/ j/ cm2) figur e 3: typical r e sponsivity ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 1 1
defe ct def i nit ions operationing co nditions tes t conditions : t=25 o c, f clk =2 mh z, t in t = 1 . 06 6m s e c speci f i ca ti o n s f i e l d d e f e ct typ e thresh o l d unit s not e s n u m b e r d a r k b r i g h t 8 . 0 m v 1 , 2 0 bri g h t b r i g h t /dar k 1 0 % 1 , 3 0 bri g h t e x posure c o n t ro l 4.0 mv 1, 4 , 5 16 notes : 1. defective pixe ls will be sep a rated b y at least one non-defective pixe l within and across channe ls. 2. pixels whose respon se is greater than the average r e sp onse by t h e specified t h reshold. se e line 1 in fig u re below. 3. pixels whose response is g r eater or less than the aver age respon se by the specified th resh old. see lin e s 2 an d 3 in figure below. 4. p i xels wh o s e respon se devi ates fr om the average pixel response by the specified threshold when operating in exposure con t rol mode. se e lines 4 and 5 in the figure below. 5. defect coordinates are av ai lable up on re quest. exposure exposure signal o u t signal o u t 4 5 average pixel average pixel 3 2 1 ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 1 2
operat ion absolute maximum ratings d e scripti o n symbol minim u m m a x i m u m u n i t s n o t e s gate pin voltage s v gate - 0 . 5 + 1 6 v 1 , 2 pin to pin vo ltag e v pin-p i n 1 6 v 1 , 3 diode pin voltag es v diode - 0 . 5 + 1 6 v 1 , 4 ou t p ut b i as cu rren t i dd - 1 0 m a 5 outpu t load cap a citance c vid, load 1 5 pf c c d c l oc ki ng f r e q ue nc y f c 2 0 m h z 6 notes : 1. referenced to substrate voltage. 2. includes pin s : 1, 2, 2s, tg1, tg2, r, ig, and lo gn. 3. voltage d i ffer e nce (either p o larity) between any two pins. 4. includes pin s : vidn, rd, vd d, ls and id. 5. care must be taken not to short output pins to gr ound during operation as this may cau s e se rious d a mage to the output s t ructures . 6. charge transfer efficiency will degr ade at frequencies higher than the nominal (2mhz) clocking frequenc y. vidn load resi stor valu e s ma y n eed to be dec r eased as well to achieve re quired output bandwidths . to device function sub i/o pin v t - 20 v figu r e 4 : esd p r otection circuit ca uti o n : to all o w f o r ma xi mum pe rform a nce, this device contains limite d i/o protection and may be sensitive to electrostat ic induced damage. devices should be installed in acc o rdance wit h strict esd handlin g procedures! ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 1 3
dc bias operating conditio ns d e s c r i p t i o n s y m b o l min i m u m n o m i n a l m a x i m u m u n i t s n o t e s subst r ate v sub 0 v r e set dr ain bias v rd +1 1 . 5 + 1 2 . 0 + 1 2 . 5 v output buffer s u pply vdd +1 1.5 +1 2 . 0 + 1 2 . 5 v li ght s h i e ld/drai n bi as vls +1 1.5 +1 2 . 0 + 1 2 . 5 v outpu t bi as c u r r e nt/c h. i ddn -4 .0 - 6 .0 - 8 .0 m a 1 test pin-inpu t g a te/log v ig + 1 2 . 0 v test pin-input di ode v id + 1 2 . 0 v notes : a current sink must be su pplied for eac h output. load capacita nce s h ould be minimized s o as not to limit ba ndwidth. se e example below. 2n2369 o r sim ila r * r2=120 ? * r1=600 ? * 0. 1 f to d e v i c e out put p i n: v i dn (m i n i m i z e pat h lengt h) b u ffered output vd d *choose values optimized for specific op erating frequ e ncy. r2 sh ould not be les s than 75 ? f i gure 5: t y pi c a l o u tpu t bi a s /b uf f e r c i rc ui t ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 1 4
ac operating conditions clo c k levels d e s c r i p t i o n s y m b o l min i m u m n o m i n a l m a x i m u m u n i t s n o t e s ccd r e adou t clo c ks high v 1h ,v 2nh +4. 7 5 + 5 . 0 +5. 2 5 v ccd r e adou t clo c ks low v 1l ,v 2nl - 0 . 1 0 +0. 1 v tr ansf er c l ocks high v tgnh +4. 7 5 + 5 . 0 +5. 2 5 v tr ansf er c l ocks low v tgnl - 0 . 1 0 +0. 1 v re s e t c l oc k hi gh v rh +4. 7 5 + 5 . 0 +5. 2 5 v re s e t c l oc k low v rl - 0 . 1 0 +0. 1 v exposure clocks high v lognh +4. 7 5 + 5 . 0 +5. 2 5 v 1 exposu r e clocks low v lognl - 0 . 1 0 +0. 1 v 1 note: 1. tie pin to 0v for applicatio ns where exposure control is not used. ac timing levels d e s c r i p t i o n s y m b o l min i m u m n o m i n a l m a x i m u m u n i t s n o t e s ccd elemen t dur a tion 1e = 1/ f clk 5 0 5 0 0 n s line/integration period 1l = t int 0.1 0 8 1 . 0 6 6 m s pd-ccd tr an s f er per i od t pd 1 . 0 s tr an sf er gate 1 clear t tg1 50 0 n s tr an sf er gate 2 clear t tg2 50 0 ns log gate du ratio n t log1 1 s log gate clear t log2 1 s reset pulse d u r a tion t rst 9 n s clamp to 2 dela y t cd 5 n s 1 sample to reset edge delay t sd 5 n s 1 ccd clock r i se time t r 3 0 n s typi c a l note: 1. recommended delays for c o rrelated dou b le sampling of output. ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 1 5
timing vidn clamp* sample* 1e v dark v sat v feedthru t sd tc d t rst t clp t spl 4e 12e 2098e 12e 2e t int tg1 tg2 logn t exp line timing 1e t pd t tg2 first dark reference pixel data valid t tg1 photodiode-to-ccd transfer timing output timing (full resolution mode) see timing notes tg1 tg2 logn 1 2 * required for correlated double sampling 1 2 r t log1 t log2 4e 12e 2098e 12e 2e 4e 12e 2098e 12e 2e 4e 12e 2098e 12e 2e 2s= 2 f i gure 6: li ne ti mi ng ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 1 6
vidn clamp* sample* output timing (2-pixel summing mode) * required for correlated double sampling r 2 2s 1e v pixel n + pixel n+1 f i gure 7: outp ut ti mi ng ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 1 7
storage and handling storage conditio ns d e s c r i p t i o n s y m b o l m i n i mum maximum u n i t s n o t e s storage temper atu r e t st 0 7 0 c 1 oper ating t e pe ra ture t op - 2 5 + 8 0 c 2 note s: 1 . n o ise per f or ma nce will degr ade w i th in cr easin g temper atur es. 2 . lon g term stor ag e at th ese temper atur es will acceler a te color filter degra d ation. esd 1. this device contains limit e d protection again s t electrostatic discharge (esd). ccd imag e sensor s can be damag e d by elec trostatic discharge. failure to do so may alt e r device performance and reliability. 2. devices shou ld be handled in accordance with strict esd p r ocedures fo r cl ass 0 (< 250v per jesd22 human body model test), or class a (<200v jesd 22 machine model test) devices. devices are shipped in static-safe containers and should only be handled at s t atic-s afe workst ation s . 3. see applicat ion note mtd/ps-1039 ?image sens or handling and bes t practices ? for proper handling an d grounding procedures . this applic ation n o te als o c o ntains recommendations for workp l ace modification s f o r the mini miz a ti on of electrostatic disch a rge. 4. store devices in contain e rs made of electro- conductive materials . cover glass care and cleanliness 1. the cover glass is highly susceptible to particles and other contamin ation. p e rform a ll as se mbly operation s in a cle a n environment. 2. touching the cover glass must be avoide d. 3. improper cleaning of the cover gl ass may damage these devices. refe r to applicat ion note m t d/ps-1 03 9 ?i m a ge senso r h a ndli ng and bes t practices?. environmental exposure 1. do not expos e to s t rong s un light for long periods of time. the color filters and/or microlense s may become discol ored. long time exposu res t o a st atic h i gh con t rast scen e sh ou ld be avoided. the image sensor may become discol ored and localize d ch an ges in respon se may occur from color fi lter/microlens aging. (this condition applie s t o c o lor pa rts only.) 2. exposure to temperat ures exceeding th e absolute max i mum level s should be av oided for storage and operation. failure to do so may alter device perfor mance and re liability. 3. avoid sudden temperature changes. 4. exposure to excessive humidity will affec t device ch aracteristic s an d sh ou ld be avo i ded. f a ilu r e to do so may alter device performan ce and reliability. 5. avoid storage of the produ c t in the presence of du st or corr osi v e agen ts or ga ses. l o n g -term storage sh ou l d be avo i ded. deterioratio n of lead solder ability may occur. it is advi sed th at th e solder ability of the device leads be re-inspected after an exte nded period of st orage, over one year. soldering recommendations 1. the solderin g iron tip te mperature is not to exceed 370oc. failure to do so may alte r device performance and reliability. 2. flow soldering method is not recommended. solder dippin g can cau s e damage to t h e glass and har m th e imaging capability of th e device. recommended method is by p a rtial heating. kod a k recommends the use of a groun d ed 30w soldering iro n . heat e a ch pin for le ss than 2 seconds duration. ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 1 8
mechan ic al i n formati on completed assembly figure 8: comple ted assembly dr awing (1 of 2) ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 1 9
figure 9: comple ted assembly dr awing (2 of 2) ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 2 0
quality assurance and reliability quality strategy all image se nsors will c o nform to t h e specifications stated in this document. this will be accompli shed through a combination of statistical process control and inspection at key p o ints of the production process. typical specification limits are not guaranteed but provided as a design target. for further information re fer to iss appl ication note mtd/ps-02 92, qu ality and reliab ility. replacement all device s are warranted agai nst failu r e in accordance with the terms of terms of sale. this does n o t inc l ude failure due to mechanical an d electrical causes defin e d as the liabilit y of the customer below. liability of the supplier a r e j e c t i s d e f i n e d a s a n i m a g e s e n s o r t h a t d o e s n o t meet all of the specifications in this document upon receipt by the customer. liability of the customer damage from mechanic al (scr atches or breakage ), or other electric a l misu se of the device be yond the stat ed absolute maximum r a tings, which occur r ed after rec e ipt of the sensor by the customer , sh a ll be th e respon si bility of the cu stomer. reliability information concerning the quality assur a nce and reliability te s t in g procedu r es an d resu lts are av ail a ble from the image sensor solutions and can be supplied upon reques t. test data retention im age sen s ors sh a ll h a ve an ide n tifyin g n u mber traceable to a test dat a file. test data shall be kept for a period of 2 ye ars after date of delivery. mechanical the device assembly dr awing is pr ovide d as a refere nce. the device will confor m to the pu blished package tolerances. kod a k reserves the right to change an y in formation c o ntained herein without not i ce. all in for m ati o n furnished by kod a k is believed to be accurate. warning: life support appl ications pol icy kod a k i m age sens ors are not authoriz ed for and s h ould not be used within life support syste m s with out the specific written consent of the east man kod a k comp any. prod uct warranty is limited to re placement of defective components and does n o t cove r injury or property or other consequential damages. revi si on chan ges revision nu mber description of changes 4 n e w color filter mater i als implemen ted. 5 updated format. added serial number s to package dr awings 5.1 c o rre c t e d re spo n si vi ty i n t a ble o n p.4 ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 2 1
this p a ge intentionally left blank. ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 2 2
this p a ge intentionally left blank. ?east m an kodak compan y, 2 008 www.kodak.com/go/imager s r e vision 5 . 1 mtd/ps-0 22 9 p 2 3
?eastman kodak company, 2008. kodak and pixelux are trademarks.

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